Modulight enters Israeli market in cooperation with Migvan
Tampere, January 22nd, 2004, Modulight, Inc. (Tampere, Finland) and Migvan Technologies & Engineering (Tel Aviv, Israel) signed today a representative agreement, which enables immediate availability of Modulight’s products into Israeli market. Modulight offers optoelectronic (OE) epiwafers, OE chips (lasers) and packaged laser components such as TO-cans and fiber pigtailed laser modules. Customized laser chips and foundry services are supporting well Modulight’s broad product and service portfolio. Modulight’s Fabry-Pérot and DFB laser dies, from lower speeds up to 10Gb/s, are available as standard products in volumes, Continue reading →